Advanced Optowave | Laser Marking, Cutting & Welding Systems

Minimal Invasive Device Processing

Minimally invasive devices have revolutionized modern medicine by allowing surgeons and physicians to perform complex procedures with reduced trauma, faster recovery times, and improved patient outcomes. These devices are used in various medical specialties, including surgery, cardiology, gastroenterology, and gynecology, among others. Examples of minimally invasive devices include: Laparoscopic instruments, Endoscopes, Stents, Catheters and guidewires.

Consumer Electronics

The consumer electronics market is responsible for the recent explosion of new materials that have made it into real world products. The influx of new materials and the ever-changing requirement to make our consumer products smaller with additional functions and features has presented the manufacturing world with a lot of new challenges. These challenges have proven difficult or seemingly impossible to resolve with traditional manufacturing technologies.

New Energy

Recent development in laser technology and optical instruments enables new processes and technologies in the energy industry. Laser processing provides several advantages over the conventional processes includes precision of operation, local treatment, fast processing, and low cost. Shaping the energy materials is one of the major applications in laser processing, includes net shaping of thermoelectric pins, scribing of thin-film solar cells, edge isolation of crystalline silicon solar cells, laser doping of solar cells, surface texturing for hydrophobicity, and photon capturing.
• Scribing
• Texturing
• Doping
• Surface alloying
• Net shaping

Semiconductor

Laser processing plays a crucial role in the semiconductor industry, where it is used for various applications throughout the manufacturing process. Key uses of laser processing in the semiconductor industry includes: wafer dicing and singulation, via hole drilling, annealing and doping, wafer marking and inspection.

Display

Nowadays, laser processing has become an emerging technology in display production primarily for laser lift off, laser induced forward transfer (LIFT), laser cutting and drilling of various levels, and laser annealing. High ultraviolet lasers offer a unique combination of advantages to meet those process challenges. Short wavelength UV lasers can directly ablate thin layers of material at surface without damaging the substrate material. In combination with ultrashort-pulse (USP), cold processing also avoids thermal shock and damage to underlying materials. Advanced Optowave’s AWAVE, AOPICO Montauk, AOFEMTO Jericho are designed to maintain high quality, precision and consistency in manufacturing processing.

Laser marking/engraving/surface structuring

Laser marking and engraving offer numerous benefits in the medical device industry, including high precision, permanent marking, non-contact process, and compatibility with various materials. The technology is widely adopted due to its ability to meet regulatory requirements, enhance patient safety, and ensure product integrity.

PCB

Laser processing in the printed circuit board (PCB) industry is seen as critical in technological advancement with cutting-edge innovation that ensures practical and stylish electronic devices. It offers significant benefits in this context in terms of laser PCB depaneling, laser PCB drilling, laser marking.
• High cutting edge quality
• Stress-free, dust-free processing
• Material diversity, rigid, flexible, metallic and ceramic
• Shape design freedom

Metal Processing

Laser technology offers several advantages over traditional methods, such as precision, speed, versatility, and minimal heat-affected zones. Common laser processing of metal includes: cutting, welding, drilling, engraving, marking, etc.