Focus on the micro-machining field
Laser source manufacturer and solutions provider
Minimal Invasive Device Processing
Minimally invasive devices have revolutionized modern medicine by allowing surgeons and physicians to perform complex procedures with reduced trauma, faster recovery times, and improved patient outcomes. These devices are used in various medical specialties, including surgery, cardiology, gastroenterology, and gynecology, among others. Examples of minimally invasive devices include: Laparoscopic instruments, Endoscopes, Stents, Catheters and guidewires.
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Consumer Eletronics
The consumer electronics market is responsible for the recent explosion of new materials that have made it into real world products. The influx of new materials and the ever-changing requirement to make our consumer products smaller with additional functions and features has presented the manufacturing world with a lot of new challenges. These challenges have proven difficult or seemingly impossible to resolve with traditional manufacturing technologies.
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New Energy
Recent development in laser technology and optical instruments enables new processes and technologies in the energy industry. Laser processing provides several advantages over the conventional processes includes precision of operation, local treatment, fast processing, and low cost. Shaping the energy materials is one of the major applications in laser processing, includes net shaping of thermoelectric pins, scribing of thin-film solar cells, edge isolation of crystalline silicon solar cells, laser doping of solar cells, surface texturing for hydrophobicity, and photon capturing.
• Scribing
• Texturing
• Doping
• Surface alloying
• Net shaping
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• Scribing
• Texturing
• Doping
• Surface alloying
• Net shaping
Semiconductor
Laser processing plays a crucial role in the semiconductor industry, where it is used for various applications throughout the manufacturing process. Key uses of laser processing in the semiconductor industry includes: wafer dicing and singulation, via hole drilling, annealing and doping, wafer marking and inspection.
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Display
Nowadays, laser processing has become an emerging technology in display production primarily for laser lift off, laser induced forward transfer (LIFT), laser cutting and drilling of various levels, and laser annealing. High ultraviolet lasers offer a unique combination of advantages to meet those process challenges. Short wavelength UV lasers can directly ablate thin layers of material at surface without damaging the substrate material. In combination with ultrashort-pulse (USP), cold processing also avoids thermal shock and damage to underlying materials. Advanced Optowave’s AWAVE, AOPICO Montauk, AOFEMTO Jericho are designed to maintain high quality, precision and consistency in manufacturing processing.
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Laser marking/engraving/surface structuring
Laser marking and engraving offer numerous benefits in the medical device industry, including high precision, permanent marking, non-contact process, and compatibility with various materials. The technology is widely adopted due to its ability to meet regulatory requirements, enhance patient safety, and ensure product integrity.
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PCB
Laser processing in the printed circuit board (PCB) industry is seen as critical in technological advancement with cutting-edge innovation that ensures practical and stylish electronic devices. It offers significant benefits in this context in terms of laser PCB depaneling, laser PCB drilling, laser marking.
• High cutting edge quality
• Stress-free, dust-free processing
• Material diversity, rigid, flexible, metallic and ceramic
• Shape design freedom
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• High cutting edge quality
• Stress-free, dust-free processing
• Material diversity, rigid, flexible, metallic and ceramic
• Shape design freedom
Metal Processing
Laser technology offers several advantages over traditional methods, such as precision, speed, versatility, and minimal heat-affected zones. Common laser processing of metal includes: cutting, welding, drilling, engraving, marking, etc.
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COMPANY INTRODUCTION
GLOBAL LASER SOLUTIONS
Founded in 2007, Advanced Optowave Corporation has been a laser solution provider. We are focusing on the laser and laser application R&D, worldwide sales and marketing, and the local service and support for our customers.
AOC laser product portfolio consists of a broad spectrum of pulsed lasers, including DPSS QS-ns lasers, ultrafast lasers and MOPA-ns lasers, covering different wavelengths from IR to DUV, and different pulse widths from nanosecond, picosecond to femtosecond. By combining the innovative laser technologies with laser process development capability, AOC can offer complete laser application solutions. With advanced optical design, vision system, motion control system and self-developed software, AOC is now supplying laser micro-processing systems.
AOC products strongly enhance our customer's capabilities and productivity in consumer electronics, biomedical applications, semiconductor and other areas. As of today, there are more than 50,000 lasers and 5,000 laser micro-process systems installed worldwide. Laser for Better Life is the company mission of AOC.
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AOC laser product portfolio consists of a broad spectrum of pulsed lasers, including DPSS QS-ns lasers, ultrafast lasers and MOPA-ns lasers, covering different wavelengths from IR to DUV, and different pulse widths from nanosecond, picosecond to femtosecond. By combining the innovative laser technologies with laser process development capability, AOC can offer complete laser application solutions. With advanced optical design, vision system, motion control system and self-developed software, AOC is now supplying laser micro-processing systems.
AOC products strongly enhance our customer's capabilities and productivity in consumer electronics, biomedical applications, semiconductor and other areas. As of today, there are more than 50,000 lasers and 5,000 laser micro-process systems installed worldwide. Laser for Better Life is the company mission of AOC.
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Application Highlights
Future Events
Studying Anti-Corrosion Surface Black Marking on Medical-Grade Metal with Ultrafast Lasers
Laser marking is a quick and accurate process using the focused laser beam to generate labels or patterns on the material surface. It has unique advantages such as fast and permanent marking with high-resolution and non-contact marking, suiting lasers for metal back marking.
14
2023.11
Laser processing transparent materials with nanosecond, picosecond and femtosecond pulses for industrial applications
Being broadly used in consumer electronics and medical devices, highly effective techniques for processing transparent- materials, such as glasses, sapphire and polymers, have attracted tremendous attention and been profoundly investigated. Due to their high optical transparency, low thermal conductivity or low melting points (polymer) or fragility, noncontact ultrafast laser micro-processing methods, including cutting, drilling, engraving, modification, were demonstrated to be effective in producing products of better qualities than those made by conventional methods.
09
2023.11
Studies on nanosecond 532nm and 355nm and ultrafast 532nm and 515nm laser cutting super-hard materials
In this paper, micro-processing of three kinds of super-hard materials of poly-crystal diamond (PCD)/tungsten-carbide (WC), CVD-diamond and cubic boron nitride (CNB) has been systematically studied using nanosecond laser (532nm and 355nm), and ultrafast laser (532nm and 515nm). Our purpose is to investigate a full laser micro-cutting solution to achieve a ready-to-use cutting tool insert (CTI). The results show a clean cut with little burns and recasting at edge. The cutting speed of ~2-10mm/min depending on thickness was obtained. The laser ablation process was also studied by varying laser parameters (wavelength, pulse width, pulse energy, repetition rate) and tool path to improve cutting speed. Also, studies on material removal efficiency (MRE) of PCD/WC with 355nm-ns and 515nm-fs laser as a function of laser fluence show that 355nm-ns laser is able to achieve higher MRE for PCD and WC. Thus, ultrafast laser is not necessarily used for superhard material cutting. Instead, post-polishing with ultrafast laser can be used to clean cutting surface and improve smoothness.
08
2023.11
