Laser processing plays a crucial role in the semiconductor industry, where it is used for various applications throughout the manufacturing process. Key uses of laser processing in the semiconductor industry includes: wafer dicing and singulation, via hole drilling, annealing and doping, wafer marking and inspection.
Nowadays, laser processing has become an emerging technology in display production primarily for laser lift off, laser induced forward transfer (LIFT), laser cutting and drilling of various levels, and laser annealing. High ultraviolet lasers offer a unique combination of advantages to meet those process challenges. Short wavelength UV lasers can directly ablate thin layers of material at surface without damaging the substrate material. In combination with ultrashort-pulse (USP), cold processing also avoids thermal shock and damage to underlying materials. Advanced Optowave’s AWAVE, AOPICO Montauk, AOFEMTO Jericho are designed to maintain high quality, precision and consistency in manufacturing processing.
