Today a wide variety of laser technologies is available to semiconductor manufacturers includes laser cutting, drilling, welding/bonding, debonding, patterning, marking, measurement, deposition, driven by motherboards, PCB, IC packaging. Chip makers and display manufacturers continuously developing advanced equipment and process to enable their products to achieve greater functionality, compact packaging, lower power consumption, and lower cost. AOC remains competitive within the semiconductor industry with a wide range of laser products for each application.
Wafer Inspection
Wafer Doping
Wafer Marking
Wafer Dicing
Semiconductor Scribing