Today a wide variety of laser technologies is available to semiconductor manufacturers includes laser cutting, drilling, welding/bonding, debonding, patterning, marking, measurement, deposition, driven by motherboards, PCB, IC packaging. Chip makers and display manufacturers continuously developing advanced equipment and process to enable their products to achieve greater functionality, compact packaging, lower power consumption, and lower cost. AOC remains competitive within the semiconductor industry with a wide range of laser products for each application.

Nowadays, laser processing has become an emerging technology in display production primarily for laser lift off, laser induced forward transfer (LIFT), laser cutting and drilling of various levels, and laser annealing. High ultraviolet lasers offer a unique combination of advantages to meet those process challenges. Short wavelength UV lasers can directly ablate thin layers of material at surface without damaging the substrate material. In combination with ultrashort-pulse (USP), cold processing also avoids thermal shock and damage to underlying materials. Advanced Optowave’s AWAVE, AOPICO Montauk, AOFEMTO Jericho are designed to maintain high quality, precision and consistency in manufacturing processing.